Deflectable platen and associated method
US11133213B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 5, 2019 |
| Grant date | Sep 28, 2021 |
| Priority date | — |
| Expiry date | Mar 27, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68735
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A deflectable platen including an annular sidewall, a first layer coupled to the annular sidewall, the first layer having a first temperature control element associated therewith, a second layer coupled to the annular sidewall and disposed in a parallel, spaced-apart relationship with the first layer to define a gap therebetween, the second layer having a second temperature control element associated therewith, and a controller coupled to the first and second temperature control elements and configured to operate the first and second temperature control elements to vary temperatures of the first and second layers relative to one another to deflect the platen to more closely match a contour of a wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.