Compliant die attach systems having spring-driven bond tools
US11134595B2 · kind B2 · utility
0Cited by
12References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 3, 2019 |
| Grant date | Sep 28, 2021 |
| Priority date | — |
| Expiry date | Sep 6, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A die attach system is provided. The die attach system includes: a support structure for supporting a substrate; a die supply source including a plurality of die for attaching to the substrate; and a bond head for bonding a die from the die supply source to the substrate, the bond head including a bond tool having a contact portion for contacting the die during a transfer from the die supply source to the substrate, the bond head including a spring portion engaged with the bond tool such that the spring portion is configured to compress during pressing of the die against the substrate using the contact portion of the bond tool.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.