Roy Brewel
9Patents
2h-index
4Co-inventors
36Inventor score
Filing activity: Sep 2, 2015 → Feb 9, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9814144B2 | Component placement device as well as a method for picking up a component and placing a component on a substrate | Emerging Cross-Sectional Technologies | 2 | Active |
| US11069555B2 | Die attach systems, and methods of attaching a die to a substrate | Electricity | 2 | Active |
| US11410870B2 | Die attach systems, and methods of attaching a die to a substrate | Electricity | 0 | Active |
| US11134595B2 | Compliant die attach systems having spring-driven bond tools | Electricity | 0 | Active |
| US10398035B2 | Component placement device | Emerging Cross-Sectional Technologies | 0 | Active |
| US11612089B2 | Component placement systems and methods of operating the same | Electricity | 0 | Active |
| US11277921B2 | Component placement device | Emerging Cross-Sectional Technologies | 0 | Active |
| US11557567B2 | Methods of attaching die to substrate using compliant die attach system having spring-driven bond tool | Electricity | 0 | Active |
| US12232271B2 | Component placement systems and methods of operating the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.