Method and device for a high temperature vacuum-safe solder resist utilizing laser ablation of solderable surfaces for an electronic module assembly
US11135669B2 · kind B2 · utility
0Cited by
13References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 17, 2018 |
| Grant date | Oct 5, 2021 |
| Priority date | — |
| Expiry date | Nov 25, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1173
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for manufacturing an electronic component having attaches includes providing a first component having a first attach, forming trenches on a portion of the first attach with a laser to form a solder stop, and providing a second component comprising a second attach. The process further includes providing solder between the first attach and the second attach to form a connection between the first component and the second component, where the trenches contain the solder to a usable area. A device produced by the process is disclosed as well.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.