Gas spraying apparatus, substrate processing facility including the same, and method for processing substrate using substrate processing facility
US11136670B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 12, 2018 |
| Grant date | Oct 5, 2021 |
| Priority date | — |
| Expiry date | Jul 14, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/402
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A gas spraying apparatus according to the embodiment of the present invention includes a spray part disposed and aligned on one side outside a substrate in the width direction of the substrate, and having a plurality of nozzles for spraying gas toward the substrate, and a spray control unit for automatically controlling whether or not each of a plurality of nozzles sprays gas such that a gas density distribution type in the width direction of the substrate becomes a targeted gas density distribution type by the gas sprayed through the plurality of nozzles. Therefore, according to the embodiment of the present invention, it is easy to carry out the process with a plurality of types of process types or a plurality of types of gas density distribution types, and a time for adjusting the open or close operation of the plurality of nozzles can be shortened.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.