Substrate processing apparatus
US11139152B2 · kind B2 · utility
0Cited by
3References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 9, 2019 |
| Grant date | Oct 5, 2021 |
| Priority date | — |
| Expiry date | Jun 11, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/334
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The inventive concept relates to an apparatus for processing a substrate. The substrate processing apparatus includes a scatter that is disposed over a baffle and that separates plasma and impurities. The scatter includes a plate having a first opening formed in a central area thereof when viewed from above and a collision block that is disposed over the first opening to face the first opening and that collides with plasma supplied from a plasma generation unit and impurities.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.