Device and method for positioning first object in relation to second object
US11139193B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 12, 2018 |
| Grant date | Oct 5, 2021 |
| Priority date | — |
| Expiry date | Oct 2, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/85132
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This mounting device (100) comprises: a base (10) that moves linearly in relation to a substrate (16); a bonding head (20) that is attached to the base (10); a camera (25) that is attached to the base (10) and identifies the position of the substrate (16); a linear scale (33) having a plurality of graduations along the movement direction; a bonding head-side encoder head (31); and a camera-side encoder head (32). A control unit (50) causes the base (10) to move to a position where the bonding head-side encoder head (31) detects the position of a graduation. Due to this configuration, positioning accuracy of a semiconductor die (15) in relation to the substrate (16) is improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.