Pressure-sensitive adhesive compound containing a cross-linked nanoparticle network, method of production and use thereof

US11142672B2 · kind B2 · utility

Assignee

• tesa SE · DE

Inventors

• Klaus Keite-Telgenbüscher · Hamburg, DE
• Christian Schuh · Hamburg, DE
• Bernd Lühmann · Norderstedt, DE
• Thilo Dollase · Hamburg, DE
• Minyoung Bai · Hamburg, DE
• Thorsten Krawinkel · Hamburg, DE

Key dates

• Filing date: Mar 29, 2019
• Grant date: Oct 12, 2021
• Expiry date: May 27, 2039

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/287
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

Pressure-sensitive adhesive compound comprising at least two components forming one phase each, from which an IPN with at least two phases is produced by a cross-linking build-up reaction, the first phase having at least a softening point temperature of less than 23° C., and the second phase, after the build up reaction, having a softening temperature of greater than 23° C., the two phases having a morphology of a cross-linked nanoparticle network after the build-up reaction.