Inventor · Hamburg, DE

Minyoung Bai

7Patents
3h-index
9Co-inventors
46Inventor score

Filing activity: Jul 30, 2012 → Sep 10, 2021

Most-cited inventions

PatentTitleAreaCited byStatus
US9543549B2 Adhesive tape for encapsulating an organic electronic arrangement Emerging Cross-Sectional Technologies 34 Active
US9714366B2 Liner for protection of adhesives Emerging Cross-Sectional Technologies 4 Active
US9593263B2 Liner for protecting adhesive compounds Emerging Cross-Sectional Technologies 4 Active
US10308845B2 Adhesive tape featuring adhesive with continuous polymer phase Chemistry; Metallurgy 1 Active
US11866614B2 Pressure-sensitive adhesive compound containing a cross-linked nanoparticle network, method of production and use thereof Emerging Cross-Sectional Technologies 0 Active
US10386209B2 Linear for protection of adhesives Emerging Cross-Sectional Technologies 0 Active
US11142672B2 Pressure-sensitive adhesive compound containing a cross-linked nanoparticle network, method of production and use thereof Emerging Cross-Sectional Technologies 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.