Method and system for data collection and analysis for semiconductor manufacturing
US11143689B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 5, 2018 |
| Grant date | Oct 12, 2021 |
| Priority date | — |
| Expiry date | Jan 26, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/30
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method includes receiving system test data for a plurality of electronic systems. Each of the electronic systems includes a plurality of electronic components. The method also includes determining a relationship between a set of electronic components and the electronic systems upon which the electronic components of the set of electronic components are assembled and receiving manufacturing attributes including spatial data for the set of electronic components. The method further includes selecting a data subset from the system test data corresponding to a subgroup of the set of electronic components. The subgroup includes components within an area defined on a substrate according to a spatial pattern and that is fewer than all of the set of electronic components on the substrate. Additionally, the method includes identifying an outlier relative to the data subset and communicating information about the outlier to at least one of a system or a component manufacturer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.