Method of analyzing a manufacturing of a semiconductor structure
US11145526B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 29, 2019 |
| Grant date | Oct 12, 2021 |
| Priority date | — |
| Expiry date | Jul 19, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of monitoring or analyzing a manufacturing of a semiconductor structure includes providing a semiconductor structure; providing a camera disposed around the semiconductor structure; disposing a liquid substance over the semiconductor structure; removing a portion of the semiconductor structure; removing the liquid substance from the semiconductor structure; capturing a plurality of first images of the semiconductor structure by the camera; analyzing the plurality of first images; identifying a region of the semiconductor structure where a residue of the liquid substance is disposed based on the analysis of the plurality of first images; and performing a response based on the identification of the region of the semiconductor structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.