Advanced communications array
US11145952B2 · kind B2 · utility
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1References
13Claims
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Assignee
Inventors
Key dates
| Filing date | Nov 14, 2019 |
| Grant date | Oct 12, 2021 |
| Priority date | — |
| Expiry date | Nov 14, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10287
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A communications array includes a support structure configured to array elements, and a plurality of array elements supported by the support structure. Each array element is fabricated from an advanced manufacturing techniques (AMT) process. The support structure may be fabricated from a printed circuit board (PCB) or similar dielectric material. Each array element may include a radiator and/or a beamformer manufactured using the AMT process. The communications array further may include a copper vertical launch (CVL) and/or an electromagnetic boundary.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.