Microelectronic package electrostatic discharge (ESD) protection
US11147197B2 · kind B2 · utility
3Cited by
1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 21, 2019 |
| Grant date | Oct 12, 2021 |
| Priority date | — |
| Expiry date | Nov 1, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/498
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Embodiments may relate to a material to provide electrostatic discharge (ESD) protection in an electrical device. The material may include first and second electrically-conductive carbon allotropes. The material may further include an electrically-conductive polymer that is chemically bonded to the first and second electrically-conductive carbon allotropes such that an electrical signal may pass between the first and second electrically-conductive carbon allotropes. Other embodiments may be described or claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.