Patent · US Active

Method for dressing polishing pads

US11148250B2 · kind B2 · utility

0Cited by

10References

18Claims

0Family size

Assignee

Siltronic AG · DE

Inventors

Vladimir Dutschke · Lengefeld, DE
Torsten Olbrich · Dresden, DE
Leszek Mistur · Burghausen, DE
Markus Schnappauf · Rosenheim, DE

Key dates

Filing date	Jan 13, 2016
Grant date	Oct 19, 2021
Priority date	—
Expiry date	Jun 29, 2037

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB24B53/12
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A method dresses one polishing cloth or two polishing pads simultaneously, in which a polishing cloth has been applied to a polishing plate, with at least one dresser (4), which is equipped with at least one dressing element (8), this at least one dressing element (8) being in contact with the at least one polishing cloth (11, 12) to be dressed, wherein the at least one polishing plate (21, 22) is rotated with a relative rotational speed and the at least one dresser (4) is rotated with a relative rotational speed and at least two different combinations of directions of rotation of the two pairs of polishing plates (21, 22) and pin wheels (31, 32) are executed during the simultaneous dressing of two polishing pads (11, 12) or during the dressing of one polishing cloth (11) of the polishing plate (21) and of the at least one dresser (4).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.