Method of controlling placement of micro-objects
US11148941B2 · kind B2 · utility
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13Claims
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Key dates
| Filing date | Dec 31, 2018 |
| Grant date | Oct 19, 2021 |
| Priority date | — |
| Expiry date | Aug 30, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49002
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
Disclosed are methods and systems of controlling the placement of micro-objects on the surface of a micro-assembler. Control patterns may be used to cause phototransistors or electrodes of the micro-assembler to generate dielectrophoretic (DEP) and electrophoretic (EP) forces which may be used to manipulate, move, position, or orient one or more micro-objects on the surface of the micro-assembler.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.