Patent · US Active

Method of controlling placement of micro-objects

US11148941B2 · kind B2 · utility

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1References
13Claims
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Assignee

Inventors

Key dates

Filing dateDec 31, 2018
Grant dateOct 19, 2021
Priority date
Expiry dateAug 30, 2039

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T29/49002
  • WIPO fieldMicro-structural and nano-technology
  • WIPO sectorChemistry

Abstract

Disclosed are methods and systems of controlling the placement of micro-objects on the surface of a micro-assembler. Control patterns may be used to cause phototransistors or electrodes of the micro-assembler to generate dielectrophoretic (DEP) and electrophoretic (EP) forces which may be used to manipulate, move, position, or orient one or more micro-objects on the surface of the micro-assembler.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.