Thickness measurement apparatus, thickness measurement method, and thickness measurement program
US11150080B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2018 |
| Grant date | Oct 19, 2021 |
| Priority date | — |
| Expiry date | Jun 22, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B11/06
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A thickness measuring device is provided. The thickness measuring device may include a terahertz wave signal processing unit configured to receive a terahertz wave according to at least one mode of a reflection mode and a transmission mode, a refractive index information acquisition unit configured to acquire refractive index information of the thickness measurement sample in consideration of second-time difference information between a first reflected terahertz wave and a second reflected terahertz wave, and a thickness information acquisition unit configured to acquire thickness information of the thickness measurement sample in consideration of the refractive index information.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.