Metal track routing with buffer bank insertion
US11151298B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 21, 2019 |
| Grant date | Oct 19, 2021 |
| Priority date | — |
| Expiry date | Nov 21, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2117/10
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Examples described herein provide for a technique for metal track routing with buffer bank insertion in a representation of a hardware design of an integrated circuit. In an example, pins of ports of hardblocks in a placed layout are identified. Logical tracks for nets associated with the pins of the ports are generated and assigned to respective metal layers. Logical tracks and corresponding nets are grouped into respective groups. Buffer bank(s) is inserted into the placed layout. Each buffer bank is for a group of logical tracks and divides each logical track and net of the group of logical tracks. Each buffer bank has pins associated with the respective divided nets. Each pin of the buffer bank(s) is assigned to a middle or higher metal layer. Metal tracks are generated in a representation of a hardware layout based on the logical tracks and pins of the ports and buffer bank(s).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.