Localized catalyst for enhanced thermal interface material heat transfer
US11152282B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 19, 2020 |
| Grant date | Oct 19, 2021 |
| Priority date | — |
| Expiry date | Jun 19, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/3737
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An IC device package includes an IC device that is connected to a lid by a thermal interface material (TIM). A catalyst material is formed upon one or more regions upon an upper surface of the IC device and/or an under surface of the lid. The catalyst material increases the rate of crosslinking of polymer chains of the TIM during TIM curing and/or increases the strength of crosslinks that link polymer chains of the TIM during TIM curing. The catalytically enhanced regions have a higher coefficient of heat transfer relative to non-catalytically enhanced regions. Therefore, the catalytically enhanced regions efficiently transfer heat from the IC device to the lid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.