Etchant-accessible carrier substrate for display manufacture
US11152533B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 25, 2019 |
| Grant date | Oct 19, 2021 |
| Priority date | — |
| Expiry date | May 16, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/036
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Techniques are disclosed for utilizing an etchant-accessible carrier substrate that enables etching through the carrier substrate. More particularly, an etchant is provided access to the adhesive layer via the etchant-accessible carrier substrate via one or more holes in the etchant-accessible carrier substrate. The size and/or pattern of the holes may vary, depending on desired functionality. The etching process may be optionally stopped prior to the removal of all of the adhesive layer such that at least a portion of the adhesive layer remains, which can help ensure the light-emitting structures do not slip off of the etchant-accessible carrier substrate as the etchant-accessible carrier substrate is moved from one location to another during the fabrication process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.