Temperature controlled substrate support assembly
US11158526B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 22, 2014 |
| Grant date | Oct 26, 2021 |
| Priority date | — |
| Expiry date | May 22, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6831
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Implementations described herein provide a substrate support assembly which enables both lateral and azimuthal tuning of the heat transfer between an electrostatic chuck and a heater assembly. The substrate support assembly comprises an upper surface and a lower surface; one or more main resistive heaters disposed in the substrate support; and a plurality of heaters in column with the main resistive heaters and disposed in the substrate support. A quantity of the heaters is an order of magnitude greater than a quantity of the main resistive heaters and the heaters are independently controllable relative to each other as well as the main resistive heater.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.