High powered RF part for improved manufacturability
US11158920B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 13, 2017 |
| Grant date | Oct 26, 2021 |
| Priority date | — |
| Expiry date | Apr 13, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3442
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electrical component, such as an RF device or thermal bridge, for use with a printed circuit board. The component has a first dielectric layer having a top and a bottom, a first conductive trace positioned on the bottom of the dielectric layer, and a first ground layer positioned on the bottom of the dielectric layer and spaced apart from the first conductive trace. For RF applications, a second conductive trace is positioned on top of first dielectric, a second dielectric is positioned on top of the second conductive trace, and a second ground plane is positioned on top of the second dielectric. A printed circuit board having a third conductive trace may then be coupled to the first conductive trace by a first solder layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.