Composition for surface treatment, method for producing composition for surface treatment, surface treatment method, and method for producing semiconductor substrate
US11162057B2 · kind B2 · utility
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2References
12Claims
0Family size
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Key dates
| Filing date | Sep 11, 2018 |
| Grant date | Nov 2, 2021 |
| Priority date | — |
| Expiry date | Sep 11, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A composition for surface treatment according to the present invention is used for treating the surface of an object to be polished after polishing, the composition for surface treatment including: a water-soluble polymer having a constituent unit derived from glycerin; an acid; and water, wherein the composition for surface treatment has a pH of 5 or lower.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.