Heat exchanger assemblies for electronic devices and related methods
US11162734B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 28, 2019 |
| Grant date | Nov 2, 2021 |
| Priority date | — |
| Expiry date | Mar 23, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20927
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Heat exchanger assemblies for electronic devices and related methods are disclosed. A heat exchanger assembly may include a heat transfer body that has a face that forms open passageways, and a cover structure attached to the heat transfer body that encloses the open passageways, thereby forming enclosed fluid conduits. Heat exchanger assemblies as described herein may be thermally coupled to a center waveguide section of a spatial power-combining device. Related methods include forming open passageways by selectively removing material from a face of a heat transfer body. Multiple heat transfer bodies may be formed simultaneously by forming multiple groups or patterns of open passageways across a larger area of a heat transfer body material, and subsequently singulating the heat transfer body material into multiple heat transfer bodies. Cover structures as previously described may be formed on the heat transfer bodies before or after singulation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.