Method for determining material removal and device for the beam machining of a workpiece

US11162778B2 · kind B2 · utility

Assignee

• Carl Zeiss SMT GmbH · DE

Inventors

• Steffen Bezold · Nuremberg, DE
• Stephan Six · Aalen, DE

Key dates

• Filing date: Sep 23, 2019
• Grant date: Nov 2, 2021
• Expiry date: Dec 25, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01J37/3053
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A method for determining material removal by an ion beam (3) on a test workpiece (7) which is disposed in a machining chamber (5) of a housing (6) of a device (1) for beam machining, wherein the test workpiece (7) has a substrate (8) and a layer (9) applied to the substrate. The method includes a) optically determining a layer thickness (d1) of the layer applied to the substrate, b) removing material of the layer from the test workpiece with the ion beam, c) optically determining the layer thickness (d2) of the layer applied to the substrate, and d) determining the material removal by comparing the layer thickness determined in step a) with the layer thickness determined in step c). Also disclosed is a device (1) for beam machining a workpiece (2) with which the method can be carried out.