Seasoning process for establishing a stable process and extending chamber uptime for semiconductor chip processing
US11164724B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 5, 2018 |
| Grant date | Nov 2, 2021 |
| Priority date | — |
| Expiry date | Sep 14, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32862
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Embodiments of the present disclosure generally provide improved methods for processing substrates with improved process stability, increased mean wafers between clean, and/or improved within wafer uniformity. One embodiment provides a method for seasoning one or more chamber components in a process chamber. The method includes placing a dummy substrate in the process chamber, flowing a processing gas mixture to the process chamber to react with the dummy substrate and generate a byproduct on the dummy substrate, and annealing the dummy substrate to sublimate the byproduct while at least one purge conduit of the process chamber is closed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.