Substrate processing device and substrate processing method
US11164750B2 · kind B2 · utility
1Cited by
3References
7Claims
0Family size
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Key dates
| Filing date | Aug 27, 2019 |
| Grant date | Nov 2, 2021 |
| Priority date | — |
| Expiry date | Aug 27, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67757
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate processing method includes a first processing step of processing a substrate using phosphoric acid set to a first temperature in a processing tank, and a second processing step of processing the substrate using phosphoric acid set to a second temperature in the processing tank.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.