Cold-welded flip chip interconnect structure
US11165010B2 · kind B2 · utility
0Cited by
10References
14Claims
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Assignee
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Key dates
| Filing date | Feb 11, 2019 |
| Grant date | Nov 2, 2021 |
| Priority date | — |
| Expiry date | Feb 11, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N60/805
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In an embodiment, a quantum device includes a first set of protrusions formed on a substrate and a second set of protrusions formed on a qubit chip. In the embodiment, the quantum device includes a set of bumps formed on an interposer, the set of bumps formed of a material having above a threshold ductility at a room temperature range, wherein a first subset of the set of bumps is configured to cold weld to the first set of protrusions and a second subset of the set of bumps is configured to cold weld to the second set of protrusions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.