Patent · US Active

Chemical-mechanical polishing composition comprising benzotriazole derivatives as corrosion inhibitors

US11168239B2 · kind B2 · utility

0Cited by
7References
17Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 28, 2020
Grant dateNov 9, 2021
Priority date
Expiry dateApr 28, 2040

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/461
  • WIPO fieldBasic materials chemistry
  • WIPO sectorChemistry

Abstract

A chemical-mechanical polishing (CMP) composition is provided comprising (A) one or more compounds selected from the group of benzotriazole derivatives which act as corrosion inhibitors and (B) inorganic particles, organic particles, or a composite or mixture thereof. The invention also relates to the use of certain compounds selected from the group of benzotriazole derivatives as corrosion inhibitors, especially for increasing the selectivity of a chemical mechanical polishing (CMP) composition for the removal of tantalum or tantalum nitride from a substrate for the manufacture of a semiconductor device in the presence of copper on said substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.