Chemical-mechanical polishing composition comprising benzotriazole derivatives as corrosion inhibitors
US11168239B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 28, 2020 |
| Grant date | Nov 9, 2021 |
| Priority date | — |
| Expiry date | Apr 28, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/461
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A chemical-mechanical polishing (CMP) composition is provided comprising (A) one or more compounds selected from the group of benzotriazole derivatives which act as corrosion inhibitors and (B) inorganic particles, organic particles, or a composite or mixture thereof. The invention also relates to the use of certain compounds selected from the group of benzotriazole derivatives as corrosion inhibitors, especially for increasing the selectivity of a chemical mechanical polishing (CMP) composition for the removal of tantalum or tantalum nitride from a substrate for the manufacture of a semiconductor device in the presence of copper on said substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.