Formation of terminal metallurgy on laminates and boards
US11168400B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 21, 2018 |
| Grant date | Nov 9, 2021 |
| Priority date | — |
| Expiry date | Jun 23, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/423
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
At least one plating pen is brought into aligned relationship with at least one hole defined in a board. The pen includes a central retractable protrusion, a first shell surrounding the protrusion and defining a first annular channel therewith, and a second shell surrounding the first shell and defining a second annular channel therewith. The protrusion is lowered to block the hole and plating material is flowed down the first channel to a surface of the board and up into the second channel, to form an initial deposit on the board surface. The protrusion is raised to unblock the hole, and plating material is flowed down the first annular channel to side walls of the hole and up into the second annular channel, to deposit the material on the side walls of the hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.