Patent · US Active

Gap filling composition and pattern forming method using low molecular weight compound

US11169443B2 · kind B2 · utility

0Cited by

1References

19Claims

0Family size

Assignee

Merck Patent GmbH · DE

Inventors

Xiaowei Wang · Shizuoka, JP
Tatsuro Nagahara · Kakegawa, JP

Key dates

Filing date	Apr 3, 2017
Grant date	Nov 9, 2021
Priority date	—
Expiry date	Apr 5, 2037

Classification

Technology area (CPC G)Physics
CPC primaryG03F7/38
WIPO fieldOptics
WIPO sectorInstruments

Abstract

There is provided a gap filling composition which can reduce pattern collapse and a pattern forming method using the composition. There is provided a gap filling composition including a gap filling compound, an organic solvent, and as required, water, the gap filling compound having a certain structure and containing hydroxyl groups, carboxyl groups, or amino groups intramolecularly. There is provided a pattern forming method using a low molecular weight compound.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.