Semiconductor device packages and methods of manufacturing the same
US11174157B2 · kind B2 · utility
0Cited by
9References
16Claims
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Key dates
| Filing date | Jun 25, 2019 |
| Grant date | Nov 16, 2021 |
| Priority date | — |
| Expiry date | Jun 25, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/94
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device package includes a semiconductor device, a non-semiconductor substrate over the semiconductor device, and a first connection element extending from the semiconductor device to the non-semiconductor substrate and electrically connecting the semiconductor device to the non-semiconductor substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.