Resin composition and article made therefrom
US11174385B2 · kind B2 · utility
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16Claims
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Assignee
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Key dates
| Filing date | Aug 26, 2019 |
| Grant date | Nov 16, 2021 |
| Priority date | — |
| Expiry date | Feb 6, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/022
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A resin composition comprises: an unsaturated bond-containing polyphenylene ether resin; a maleimide resin of Formula (1); and a compound of Formula (2) or Formula (3). The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including prepreg viscosity variation ratio, stickiness resistance, amount of void after lamination, multi-layer board thermal resistance, glass transition temperature, ratio of thermal expansion, copper foil peeling strength and dissipation factor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.