Surface treatment compositions and articles containing same
US11174394B2 · kind B2 · utility
0Cited by
18References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2018 |
| Grant date | Nov 16, 2021 |
| Priority date | — |
| Expiry date | Dec 18, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3105
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
This disclosure relates to methods and compositions for treating a wafer having a pattern disposed on a surface of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.