Patent · US Active

Cluster tool and method using the same

US11177150B2 · kind B2 · utility

0Cited by

1References

20Claims

0Family size

Assignee

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. · TW

Inventors

Wei-Hua Houng · Hsinchu, TW
Che-Fu Chen · Hsinchu, TW

Key dates

Filing date	Mar 14, 2019
Grant date	Nov 16, 2021
Priority date	—
Expiry date	Dec 25, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/68707
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method includes transferring a wafer into a first process chamber of a cluster tool; performing a first process to the wafer in the first process chamber; transferring the wafer from the first process chamber to a second process chamber of the cluster tool after performing the first process; cleaning the first process chamber; performing a second process to the wafer in the second process chamber during cleaning the first process chamber.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.