Electromagnetic interference shielding for packages and modules
US11177223B1 · kind B1 · utility
0Cited by
0References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 2, 2020 |
| Grant date | Nov 16, 2021 |
| Priority date | — |
| Expiry date | Sep 2, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is an apparatus and methods for making same. The apparatus includes a substrate, a set of electrical contacts disposed on the surface of the substrate, and an electromagnetic interference (EMI) shield pedestal structure, disposed between an outer periphery of the set of electrical contacts and an outer portion of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.