Brigham NAVAJA
5Patents
0h-index
7Co-inventors
27Inventor score
Filing activity: Dec 21, 2018 → Mar 24, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11177223B1 | Electromagnetic interference shielding for packages and modules | Emerging Cross-Sectional Technologies | 0 | Active |
| US11948877B2 | Hybrid package apparatus and method of fabricating | Electricity | 0 | Active |
| US11581262B2 | Package comprising a die and die side redistribution layers (RDL) | Electricity | 0 | Active |
| US10804195B2 | High density embedded interconnects in substrate | Electricity | 0 | Active |
| US11552023B2 | Passive component embedded in an embedded trace substrate (ETS) | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.