Circuit device with monolayer bonding between surface structures
US11177232B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 2, 2018 |
| Grant date | Nov 16, 2021 |
| Priority date | — |
| Expiry date | Jan 26, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/122
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Techniques and mechanisms for bonding structures of a circuit device with a monolayer. In an embodiment, a patterned metallization layer or a first dielectric layer includes a first surface portion. The first surface portion is exposed to first molecules which each include a first head group and a first end group which is substantially non-reactive with the first head group. The first head groups attach to the first portion to form a first self-assembled monolayer, which is subsequently reacted with second molecules to form a second monolayer comprising moieties of the first molecules. In another embodiment, the first head group comprises a first moiety comprising a sulfur atom or a nitrogen atom, where the first end group comprises one of an acid moiety, an acid anhydride moiety, an aliphatic alcohol moiety, an aromatic alcohol moiety, or an unsaturated hydrocarbon moiety.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.