Combination air-water cooling device
US11178789B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 31, 2020 |
| Grant date | Nov 16, 2021 |
| Priority date | — |
| Expiry date | Mar 31, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20927
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Heat transfer systems and methods are disclosed. A heat transfer system includes an electronic enclosure that houses electronic components and includes a volume for a first fluid. A cold plate within the electronic enclosure is configured to contain a second fluid, and the cold plate includes a recess providing access to the second fluid. The heat transfer system also includes a heat transfer device configured to transfer heat from the first fluid to the second fluid. The heat transfer device is a single integrated piece that is situated within the recess wherein a first surface of the heat transfer device is configured to directly interface with the first fluid and a second surface of the heat transfer device is configured to directly interface with the second fluid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.