Use of compositions comprising a siloxane-type additive for avoiding pattern collapse when treating patterned materials with line-space dimensions of 50 nm or below

US11180719B2 · kind B2 · utility

Assignee

• BASF SE

Inventors

• Daniel LOEFFLER · Ludwigshafen, DE
• Mei Chin SHEN · Taoyuan, TW
• Sheng-Hsuan Wei · Hillsboro, US
• Frank Oliver Heinrich Pirrung · Ludwigshafen am Rhein, DE
• Lothar Alexander Engelbrecht · Berlin, DE
• Yeni Burk · Ludwigshafen, DE
• Andreas Klipp · Lambsheim, DE
• Marcel Brill · Ludwigshafen, DE
• Szilard Csihony · Ludwigshafen, DE

Key dates

• Filing date: Oct 29, 2018
• Grant date: Nov 23, 2021
• Expiry date: Nov 15, 2038

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C11D2111/22
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

The invention relates to the use of a non-aqueous composition comprising an organic solvent and at least one particular siloxane-type additive for treating substrates comprising patterns having line-space dimensions of 50 nm or below and aspect ratios of 4 or more as well as a method for manufacturing integrated circuit devices, optical devices, micromachines and mechanical precision devices, the said method comprising the steps of (1) providing a substrate having patterned material layers having line-space dimensions of 50 nm, aspect ratios of greater or equal 4, or a combination thereof, (2) contacting the substrate at least once with a non-aqueous composition, and (3) removing the non-aqueous composition from the contact with the substrate, wherein the non-aqueous composition comprising an organic solvent and at least one of such siloxane-type additives.