Testing device includes radiation shields for testing integrated circuits on a wafer
US11181574B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Apr 29, 2020 |
| Grant date | Nov 23, 2021 |
| Priority date | — |
| Expiry date | May 29, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2877
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention provides a testing device for electrically testing integrated circuits on a wafer. The testing device comprises a vacuum chamber, a chuck for holding the wafer, a probe card for electrically contacting the integrated circuits, means for moving the chuck relative to the probe card, a first radiation shield arranged inside the vacuum chamber and enclosing the chuck and the probe card, and a cooling unit thermally connected to the first radiation shield. The means for moving the chuck relative to the probe card comprises a supporting column having a first end and a second end, the first end of the supporting column being attached to the chuck, and the first radiation shield comprises a first fixed part having a first aperture through which the supporting column is arranged to pass, and a first movable part that is attached to the supporting column and arranged to cover the first aperture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.