Manufacturing method of heat dissipation component
US11183442B2 · kind B2 · utility
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19Claims
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Key dates
| Filing date | Aug 27, 2019 |
| Grant date | Nov 23, 2021 |
| Priority date | — |
| Expiry date | Oct 24, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/07
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention provides a manufacturing method of a heat dissipation component. A substrate is provided. The substrate has an outer surface. A patterned dry film is formed on the outer surface. The patterned dry film is composed of a plurality of microporous patterns. A thermally conductive layer is formed on a region excluding the microporous patterns on the outer surface. The patterned dry film is removed to form a plurality of micro meshes. The thermally conductive layer surrounds the micro meshes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.