COMPEQ MANUFACTURING CO., LTD.
19Patents
3Active
19Granted
33Portfolio score
Filing activity: May 7, 1990 → Aug 27, 2019 · 2 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5830800A | Packaging method for a ball grid array integrated circuit without utilizing a base plate | Emerging Cross-Sectional Technologies | 50 | Expired |
| US5882957A | Ball grid array packaging method for an integrated circuit and structure realized by the method | Electricity | 26 | Expired |
| US5059403A | Method for producing copper sulfate from waste copper-containing liquid | Chemistry; Metallurgy | 21 | Expired |
| US5006200A | Method of bonding copper and resin | Electricity | 19 | Expired |
| US5884396A | Transfer flat type ball grid array method for manufacturing packaging substrate | Emerging Cross-Sectional Technologies | 18 | Expired |
| US5843806A | Methods for packaging tab-BGA integrated circuits | Electricity | 17 | Expired |
| US6278356A | Flat, built-in resistors and capacitors for a printed circuit board | Electricity | 11 | Expired |
| US6979636B1 | Method for forming heightened solder bumps on circuit boards | Electricity | 11 | Expired |
| US5147492A | Method of bonding copper and resin | Emerging Cross-Sectional Technologies | 4 | Expired |
| US5763294A | Solid tape automated bonding packaging method | Electricity | 2 | Expired |
| US7891502B2 | Circuit board carrier | Electricity | 2 | Active |
| US6753746B2 | Printed circuit board having jumper lines and the method for making said printed circuit board | Electricity | 2 | Expired |
| US6057179A | Method and structure for packaging an integrated circuit with readily removed excess encapsulant on degating region | Electricity | 2 | Expired |
| US6675704B2 | Solder paste stenciling apparatus for minimizing residue of solder paste | Electricity | 0 | Expired |
| US6639396B2 | Detecting structure formed on a PCB to detect unavailability of the lines | Physics | 0 | Expired |
| US11183442B2 | Manufacturing method of heat dissipation component | Electricity | 0 | Active |
| US6295631A | Method for determining the compensation value of the width of a wire by measuring the resistance of the wire | Electricity | 0 | Expired |
| US8033013B2 | Method of making rigid-flexible printed circuit board having a peelable mask | Emerging Cross-Sectional Technologies | 0 | Active |
| US6585024B1 | Positioning target for laminated printed circuit board | Emerging Cross-Sectional Technologies | 0 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.