Chip protected against back-face attacks
US11183468B2 · kind B2 · utility
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2References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2017 |
| Grant date | Nov 23, 2021 |
| Priority date | — |
| Expiry date | Jun 12, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/293
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip includes at least two insulated vias passing through the chip from the front face to the rear face in which, on the side of the rear face, the vias are connected to one and the same conducting strip and, on the side of the front face, each via is separated from a conducting pad by a layer of a dielectric.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.