Vacuum pumping arrangement
US11187222B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 23, 2017 |
| Grant date | Nov 30, 2021 |
| Priority date | — |
| Expiry date | Jan 11, 2038 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF05D2260/84
- WIPO fieldEngines, pumps, turbines
- WIPO sectorMechanical engineering
Abstract
A vacuum pumping arrangement comprises a first pump which has a first inlet and a first outlet. The first inlet is fluidly connected to a first common pumping line. The first common pumping line includes a plurality of first pumping line inlets each of which is fluidly connectable to a least one process chamber within a group of process chambers that form a semiconductor fabrication tool. The vacuum pumping arrangement also includes a reserve pump which has a reserve inlet and a reserve outlet. The reserve inlet is selectively fluidly connectable to each process chamber within the group of process chambers that form the semiconductor fabrication tool. The vacuum pumping arrangement additionally includes a controller which is configured to selectively fluidly isolate the pump from one or more given process chambers and selectively fluidly connect the reserve pump with the said one or more given process chambers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.