Patent · US Active

Specialized surface mount device for symmetric heat distribution in package

US11189575B1 · kind B1 · utility

0Cited by

2References

18Claims

0Family size

Assignee

QUALCOMM Incorporated · US

Inventors

Supatta Niramarnkarn · Santee, US
Bin Xu · Ningbo City, CN
Wen Yin · Chandler, US
Yonghao An · San Diego, US

Key dates

Filing date	May 14, 2020
Grant date	Nov 30, 2021
Priority date	—
Expiry date	May 14, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An integrated circuit (IC) package is described. The IC package includes a laminate substrate. The IC package also includes an active die on a surface of the laminate substrate. The IC package further includes fin-based thermal surface mount devices on the surface of the laminate substrate proximate the active die to provide an additional heat dissipation path.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.