Supatta Niramarnkarn
2Patents
0h-index
12Co-inventors
25Inventor score
Filing activity: Oct 1, 2019 → May 14, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11626336B2 | Package comprising a solder resist layer configured as a seating plane for a device | Electricity | 0 | Active |
| US11189575B1 | Specialized surface mount device for symmetric heat distribution in package | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.