Tamper-respondent assembly with structural material within sealed inner compartment
US11191155B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 10, 2020 |
| Grant date | Nov 30, 2021 |
| Priority date | — |
| Expiry date | Dec 10, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10371
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Tamper-respondent assemblies are provided which include a circuit board, an enclosure assembly mounted to the circuit board, and a pressure sensor. The circuit board includes an electronic component, and the enclosure assembly is coupled to the circuit board to enclose the electronic component within a secure volume. The enclosure assembly includes an enclosure with a sealed inner compartment, and a structural material within the sealed inner compartment of the enclosure. The structural material within the enclosure inhibits deflection of the enclosure due to a pressure differential between pressure of the sealed inner compartment and pressure around, at least in part, the enclosure. The pressure sensor senses pressure within the sealed inner compartment of the enclosure to facilitate identifying a pressure change indicative of a tamper event.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.