Adjustable substrate support and adjustment method
US11195743B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 17, 2020 |
| Grant date | Dec 7, 2021 |
| Priority date | — |
| Expiry date | Jul 17, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68757
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A stage for supporting a semiconductor substrate is disclosed. The stage includes a platform that defines a plurality of apertures, and a plurality of burls that protrude from the apertures, where the plurality of burls have support surfaces for supporting a region of the semiconductor substrate. The stage includes an actuator coupled to at least a first burl included in the plurality of burls, wherein the actuator is operable to adjust an elevation of a first support surface of the first burl relative to the platform, and control circuitry that controls operation of the actuator to establish a substantially-planar alignment of the support surface of the first burl with a support surface of at least a second burl included in the plurality of burls.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.