Method for fabricating an encapsulated electronic package using a supporting plate
US11195812B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 17, 2020 |
| Grant date | Dec 7, 2021 |
| Priority date | — |
| Expiry date | Mar 17, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for fabricating an electronic package is provided. A plurality of packaging structures are provided, each of which having a carrier and at least one electronic component disposed on the carrier. The plurality of packaging structures are disposed on a supporting plate. An encapsulation layer is formed on the supporting plate and encapsulates the plurality of packaging structures. Even if there are various types of electronic packages of different specifications in the market, the molds that the encapsulation layer uses can still be developed for a supporting plate of a certain specification. Therefore, the fabrication cost of the electronic package is reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.