Solid-state imaging device and imaging device with shared circuit elements
US11195869B2 · kind B2 · utility
2Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 5, 2019 |
| Grant date | Dec 7, 2021 |
| Priority date | — |
| Expiry date | Dec 18, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/199
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An imaging device includes a plurality of unit pixels disposed into pixel groups that are separated from one another by isolation structures. Unit pixels within each pixel group are separated from one another by isolation structures and share circuit elements. The isolation structures between pixel groups are full thickness isolation structures. At least a portion of the isolation structures between unit pixels within a pixel group are deep trench isolation structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.